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ZXTCM322
MPPSTM Miniature Package Power Solutions 50V NPN LOW SATURATION TRANSISTOR
SUMMARY VCEO= 50V; RSAT = 68m ; IC= 4A DESCRIPTION
Packaged in the innovative 2mm x 2mm MLP (Micro Leaded Package) outline, this new 4th generation low saturation transistor offers extremely low on state losses making it ideal for use in DC-DC circuits and various driving and power management functions. Additionally users will also gain several other key benefits: Performance capability equivalent to much larger packages Improved circuit efficiency & power levels Lower package height (nom 0.9mm) PCB area and device placement savings Reduced component count 2mm x 2mm MLP (single die)
FEATURES
* Low Equivalent On Resistance * Extremely Low Saturation Voltage (100mV max @1A) * hFE specified up to 6A * IC= 4A Continuous Collector Current * 2mm x 2mm MLP
APPLICATIONS
* DC - DC Converters * Charging Circuits * Power switches * Motor control
PINOUT
ORDERING INFORMATION
DEVICE ZXTCM322TA ZXTCM322TC REEL 7 13 TAPE WIDTH 8mm 8mm QUANTITY PER REEL 3000 10000 2mm x 2mm Single MLP underside view
DEVICE MARKING
SC
ISSUE 2 - JUNE 2002 1
ZXTCM322
ABSOLUTE MAXIMUM RATINGS.
PARAMETER Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Peak Pulse Current (c) Continuous Collector Current (a) Base Current Power Dissipation at TA=25C (a) Linear Derating Factor Power Dissipation at TA=25C (b) Linear Derating Factor Power Dissipation at TA=25C (d) Linear Derating Factor Power Dissipation at TA=25C (e) Linear Derating Factor Operating and Storage Temperature Range SYMBOL V CBO V CEO V EBO I CM IC IB PD PD PD PD T j :T stg LIMIT 100 50 7.5 6 4 1000 1.5 12 2.45 19.6 1 8 3 24 -55 to +150 UNIT V V V A A mA W mW/C W mW/C W mW/C W mW/C C
THERMAL RESISTANCE
PARAMETER Junction to Ambient (a) Junction to Ambient (b) Junction to Ambient (d) Junction to Ambient (e) SYMBOL R JA R JA R JA R JA VALUE 83 51 125 42 UNIT C/W C/W C/W C/W
NOTES (a) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions with all exposed pads attached. (b) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions measured at t 5 secs with all exposed pads attached. (c) Repetitive rating - pulse width limited by max junction temperature. refer to Transient Thermal Impedance graph. (d) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions with minimal lead connections only. (e) For a single device surface mounted on 65sq cm2oz copper on FR4 PCB in still air conditions with all exposed pads attached. (f) The minimum copper dimensions requires for mounting are no smaller than the exposed metal pads on the base of the device, as shown in the package dimensions data. The thermal resistance for a device mounted on 1.5mm thick FR4 board using minimum copper of 1oz weight and 1mm wide wide tracks is Rth=300 C giving a power rating of Ptot=420mW.
ISSUE 2 - JUNE 2002 2
ZXTCM322
TYPICAL CHARACTERISTICS
3.5
Max Power Dissipation (W)
IC Collector Current (A)
10
VCE(SAT) Limited
3.0 2.5 2oz Cu 2.0 Note: e 1.5 1.0 1oz Cu 0.5 0.0 0 25 50 75
Note: a
Tamb=25C
1
DC
1s 100ms 10ms 1ms 100us
0.1
0.01 0.1
Single Pulse, Tamb=25C
1
10
100
100
125
150
VCE Collector-Emitter Voltage (V)
Temperature (C)
Safe Operating Area
Thermal Resistance (C/W) Thermal Resistance (C/W)
80 60
D=0.5
Derating Curve
225 200 175 150 125 100 75 50 25 0 0.1
40 20
D=0.2 Single Pulse D=0.05 D=0.1
1oz copper
2oz copper
0 100 1m
10m 100m
1
10
100
1k
1
10
100
Pulse Width (s)
Board Cu Area (sqcm)
Transient Thermal Impedance
3.5 3.0
Tamb=25C Tj max=150C Continuous 2oz copper
Thermal Resistance v Board Area
PD Dissipation (W)
2.5 2.0 1.5 1.0 0.5 0.0 0.1
1oz copper
1
10
100
Board Cu Area (sqcm)
Power Dissipation v Board Area
ISSUE 2 - JUNE 2002 3
ZXTCM322
ELECTRICAL CHARACTERISTICS (at Tamb = 25C unless otherwise stated).
PARAMETER Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cut-Off Current Emitter Cut-Off Current Collector Emitter Cut-Off Current Collector-Emitter Saturation Voltage SYMBOL V (BR)CBO V (BR)CEO V (BR)EBO I CBO I EBO I CES V CE(sat) 10 70 145 115 225 270 1.00 0.94 200 300 200 100 100 400 450 400 225 40 165 12 170 750 20 MHz pF ns ns MIN. 100 50 7.5 TYP. 190 65 8.2 25 25 25 20 100 200 220 300 320 1.05 1.00 MAX. UNIT V V V nA nA nA mV mV mV mV mV mV V V CONDITIONS. I C =100 A I C =10mA* I E =100 A V CB =80V V EB =6V V CES =40V I C =0.1A, I B =10mA* I C =1A, I B =50mA* I C =1A, I B =10mA* I C =2A, I B =50mA* I C =3A, I B =100mA* I C =4A, I B =200mA* I C =4A, I B =200mA* I C =4A, V CE =2V* I C =10mA, V CE =2V* I C =0.2A, V CE =2V* I C =1A, V CE =2V* I C =2A, V CE =2V* I C =6A, V CE =2V* I C =50mA, V CE =10V f=100MHz V CB =10V, f=1MHz V CC =10V, I C =1A I B1 =I B2 =10mA
Base-Emitter Saturation Voltage Base-Emitter Turn-On Voltage Static Forward Current Transfer Ratio
V BE(sat) V BE(on) h FE
Transition Frequency Output Capacitance Turn-On Time Turn-Off Time
fT C obo t (on) t (off)
*Measured under pulsed conditions. Pulse width=300s. Duty cycle 2%
ISSUE 2 - JUNE 2002 4
ZXTCM322
TYPICAL CHARACTERISTICS
0.25
Tamb=25C IC/IB=50
0.20 100m
VCE(SAT) (V)
VCE(SAT) (V)
IC/IB=100
0.15 0.10 0.05
100C 25C -55C
10m
IC/IB=50 IC/IB=10
1m 1m
IC Collector Current (A)
10m
100m
1
10
0.00 1m
VCE(SAT) v IC
IC Collector Current (A)
10m
100m
1
10
VCE(SAT) v IC
630 1.2
VCE=2V 100C 25C
1.0
IC/IB=50
540 450 360 270
Normalised Gain
1.0 0.8 0.6 0.4 0.2 0.0 1m 10m 100m 1
-55C
Typical Gain (hFE)
0.8
VBE(SAT) (V)
-55C
0.6
25C 100C
180 90 0 10
0.4 1m
IC Collector Current (A)
hFE v IC
IC Collector Current (A)
10m
100m
1
10
VBE(SAT) v IC
1.0
VCE=2V
0.8
VBE(ON) (V)
-55C
0.6
25C
0.4 1m 10m
100C
IC Collector Current (A)
100m
1
10
VBE(ON) v IC
ISSUE 2 - JUNE 2002 5
ZXTCM322
MLP322 PACKAGE OUTLINE (2mm x 2mm Micro Leaded Package)
CONTROLLING DIMENSIONS IN MILLIMETRES APPROX. CONVERTED DIMENSIONS IN INCHES
PACKAGE DIMENSIONS
MILLIMETRES DIM A A1 A2 A3 b b1 D D2 D4 MIN. 0.80 0.00 0.65 0.15 0.18 0.17 MAX. 1.00 0.05 0.75 0.25 0.28 0.30 INCHES MIN. 0.0315 0.00 0.0255 0.0059 0.0070 0.0066 MAX. 0.0393 0.002 0.0295 0.0098 0.0110 0.0118 DIM e E E2 E4 L L2 r 0 MILLIMETRES MIN. MAX. INCHES MIN. MAX.
0.65 REF 2.00 BSC 0.79 0.48 0.20 0.99 0.68 0.45
0.0255 REF 0.0787 BSC 0.031 0.0188 0.0078 0.039 0.0267 0.0177
0.125 MAX. 0.075 BSC 12
0.005 REF 0.0029 BSC 0 12
2.00 BSC 1.22 0.56 1.42 0.76
0.0787 BSC 0.0480 0.0220 0.0559 0.0299
(c) Zetex plc 2002
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These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to
www.zetex.com ISSUE 2 - JUNE 2002 6

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